TL;DR
Micron has opened a new advanced packaging facility in Taiwan and says its high-bandwidth memory capacity for 2027 is already fully sold out.
Micron has launched another advanced packaging and testing site, known as AATT2, in Taichung, Taiwan. The firm states that 2027 production capacity for high-bandwidth memory at this location is entirely booked. Management anticipates high-bandwidth memory demand will outpace regular DRAM expansion until 2028.
The company plans to support AI market demand through several expansions. A HBM packaging facility in Singapore is scheduled to begin operations in 2026 and will ramp up capacity in 2027. In Taiwan, the Miaoli Tongluo site aims for initial operations late in 2027, while the Taoyuan Fab 11E is slated to begin operations in 2028. Micron has invested more than NT$1.6 trillion, or approximately $49.3 billion, in Taiwan.
Micron is also expanding its Hiroshima plant in Japan with an investment of ¥1.5 trillion, or approximately $9.3 billion. Japan's Ministry of Economy, Trade and Industry is committing up to ¥536 billion, or approximately $3.3 billion, in subsidies for this project. Equipment installation at the Hiroshima site is scheduled to begin in the second half of 2028.
Workers represented by a regional union have gained approval to strike amid disagreements about bonuses, which could impact local operations.