AMD reportedly plans to use Samsung Texas plant for HBM base dies
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Reports indicate that AMD could take up nearly the entire output of Samsung's new Texas facility for producing advanced HBM components.
Industry sources suggest that AMD could utilize close to the entire manufacturing output at Samsung Foundry's soon-to-open Taylor Fab 2 location in Texas to build advanced High Bandwidth Memory base dies. Official confirmation is currently lacking from both firms.
The company aims to install equipment by February of 2029, and full-scale commercial manufacturing could begin the following year. Spanning roughly 2.7 million square feet, the new site will be about 1.5 times the size of the initial Taylor project and is slated to leverage 2nm process technology.
According to the proposals, Samsung will build the memory base dies locally before assembling them with DRAM chips originating from South Korean plants. At this time, contract terms, output amounts, and exact memory types remain private. Meanwhile, market observers note that Nvidia prefers utilizing TSMC for its customized base dies.
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Via Wccftech ↗ · Also from Digital Citizen ↗
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