TSMC reportedly drafting plans to manufacture 3D DRAM at NVIDIA's request
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TSMC is reportedly considering 3D DRAM production following a push from NVIDIA.
TSMC is reportedly drafting plans to manufacture 3D DRAM after a push from NVIDIA. The effort is reportedly being overseen by Hsu Kuo-chin, a TSMC vice president who currently manages advanced packaging technologies.
TSMC is reportedly weighing two ways to gain capacity. The company may build new fabrication plants from scratch or buy existing facilities and convert them for DRAM production. TSMC and NVIDIA have not commented on these reports.
The move toward 3D DRAM follows a decision by Micron to move away from 4F² DRAM research in favor of a 3D roadmap. While the reports do not include a specific timeline, capacity figures, or process nodes, the shift comes as AI data centers increase demand for memory. NVIDIA reportedly requested that TSMC build the base die for its custom HBM in October. If TSMC enters the memory market, it would compete directly with Samsung, SK hynix, and Micron.
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